Staff Process Engineer – Backside Processing, CMP & Thermal

Location: United States; Hybrid

At Nokia Optical Networks, advanced photonic technologies become scalable products powering the worlds communication infrastructure. Our team develops and manufactures cutting-edge Indium Phosphide (InP) Photonic Integrated Circuits (PICs), enabling coherent optics, high-speed transceivers, tunable lasers, optical amplifiers, and next-generation networking solutions.

As a Staff Process Engineer – Backside Processing, CMP & Thermal, you will lead the development, optimization, qualification, and sustainment of wafer thinning, backside processing, chemical mechanical polishing (CMP), and thermal processing technologies critical to advanced photonic device manufacturing. You will work hands-on with process equipment, consumables, materials, and metrology systems while collaborating with device, integration, lithography, etch, thin film, reliability, and manufacturing teams to develop robust, manufacturable process solutions.

The successful candidate will demonstrate strong technical leadership, a high degree of ownership, enthusiasm for manufacturing excellence, and the ability to provide fast, effective support for a 24x7 production operation.

As a Staff Process Engineer – Backside Processing, CMP & Thermal, you will lead the development, optimization, qualification, and sustainment of wafer thinning, backside processing, chemical mechanical polishing (CMP), and thermal processing technologies critical to advanced photonic device manufacturing. You will work hands-on with process equipment, consumables, materials, and metrology systems while collaborating with device, integration, lithography, etch, thin film, reliability, and manufacturing teams to develop robust, manufacturable process solutions.