Staff Dry Etch Process Engineer

Location: United States; Hybrid

At Nokia Optical Networks, advanced photonic technologies become scalable products powering the worlds communication infrastructure. Our team develops and manufactures cutting-edge Indium Phosphide (InP) photonic integrated circuits (PICs), enabling coherent optics, high-speed transceivers, tunable lasers, optical amplifiers, and next-generation networking solutions. We work closely with device design, integration, manufacturing, equipment suppliers, and product teams to bring innovative concepts from research into high-volume production.

As a Staff Dry Etch Process Engineer, you will develop, integrate, and optimize plasma etch processes used in the fabrication of advanced photonic devices. You will work hands-on with dry etch equipment, chamber hardware, consumables, masks, and metrology systems to improve critical dimensions, profile control, sidewall roughness, etch selectivity, yield, and manufacturability. You will collaborate across photolithography, thin films, wet etch, device engineering, integration, reliability, and manufacturing teams to support both technology development and production operations.

This position provides opportunities to collaborate with Nokia R&D and manufacturing organizations globally, as well as equipment and material suppliers, to develop robust process solutions aligned with Nokias optical networking technology roadmap. The role also supports adoption of advanced analytics, automation, and AI-enabled solutions to accelerate process development and operational excellence.

As a Staff Dry Etch Process Engineer, you will develop, integrate, and optimize plasma etch processes used in the fabrication of advanced photonic devices. You will work hands-on with dry etch equipment, chamber hardware, consumables, masks, and metrology systems to improve critical dimensions, profile control, sidewall roughness, etch selectivity, yield, and manufacturability. You will collaborate across photolithography, thin films, wet etch, device engineering, integration, reliability, and manufacturing teams to support both technology development and production operations.