Senior Signal Integrity Engineer (Canada)

Location: Canada; Remote

Department: Engineering

Overview

Lead the advancement of signal and power integrity solutions for state-of-the-art high-speed digital interfaces, driving robust interface performance through rigorous electromagnetic simulation and in-depth PCB design proficiency. This role is instrumental in developing practical design guidelines and ensuring the reliability of digital links operating up to 448Gbps within advanced hardware systems.

Responsibilities

• Conduct high-frequency electromagnetic simulations of next-generation interfaces (224Gbps, 448Gbps) utilizing tools such as Ansys HFSS and Keysight ADS.
• Execute detailed power delivery network (PDN) analysis with industry-standard simulation software.
• Analyze and validate signal integrity for advanced PAM4 (56Gbps, 112Gbps) and NRZ (minimum 25Gbps) digital interfaces, including comprehensive eye diagram, jitter/noise, and S-parameter correlation between simulation and measurement data.
• Develop, apply, and document best practices in impedance control, transmission line design, PCB stack-ups, and practical PCB manufacturing processes within actionable guidelines.
• Prepare precise technical documentation on simulation approaches, findings, and recommendations to inform and support the hardware development lifecycle.
• Integrate a working knowledge of Ethernet high-speed interface standards (25G/100G/400G/800G) into simulation and analysis tasks.
• Partner with PCB layout engineers to evaluate and optimize board layouts for signal and power integrity in server, data center, and network hardware platforms.

Minimum Qualifications

• Minimum 5 years of direct, hands-on experience performing signal integrity simulations for high-speed digital systems.
• Demonstrated proficiency with Ansys HFSS, Cadence Sigrity, PowerSI, Ansys SIwave, and Keysight ADS.
• Proven expertise with high-speed digital links, including PAM4 (56Gbps, 112Gbps) and NRZ (≥25Gbps).
• Extensive knowledge of signal and power integrity methodologies, PCB stack-up optimization, impedance control, and fabrication/process constraints.
• Strong organizational skills along with exceptional technical documentation capabilities.

Preferred Qualifications

• Master’s degree in Electrical Engineering, Physics, Mathematics, or a related technical discipline, or equivalent professional experience.
• 8+ years of experience with end-to-end signal and power integrity analysis for high-performance electronic hardware.
• Expertise in authoring comprehensive design guidelines for ultra-high-speed interconnects and electronic systems.
• Experience in direct collaboration with PCB fabrication vendors to implement and verify complex impedance-controlled circuit board layouts.