Director of Field Applications Engineering- Europe and APAC

Location: Cambridge, England, United Kingdom; Remote - Europe

Department: Commercial

• Position: Director, Field Applications Engineering
• Location: Remote (Based in the EU or the UK)
• Region Coverage: Europe (EU) and Asia-Pacific (APAC)
• Travel: Up to 30-40% international travel required

• Manage: Lead a distributed team of senior FAEs across EU and APAC.
• Hire: Recruit and onboard top-tier engineering talent in key regional hubs.
• Coach: Provide continuous technical mentorship and professional development.
• Align: Set clear regional goals aligned with corporate business objectives.
• Grow collaterals , to enable improved efficiency / easy of adoption by the customer

• Drive Strategy: Partner with regional sales directors to secure high-value design wins.
• Own Delivery: Act as the escalations point for critical customer technical issues.
• Guide Evaluation: Oversee customer proof-of-concepts, evaluations, and architectural reviews.
• Present: Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.

• Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
• Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
• Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

• Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• Management: 5+ years of experience managing customer-facing engineering teams (FAE or Technical Support).
• Industry: 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.

• IP Knowledge: Deep understanding of Network-on-Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
• Design Flow: Familiarity with front-end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
• Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.

• Communication: Exceptional English verbal and written communication skills.
• Cross-Cultural: Proven experience managing teams and clients across diverse cultures in Europe and Asia.
• Autonomy: Self-motivated style suited for a fast-paced, early-stage startup environment. [1]

• Master’s degree or PhD in Electrical or Computer Engineering.
• Prior experience working in a fast-growing, venture-backed silicon IP startup.
• Existing technical relationships with major Tier-1 semiconductor and system companies in the EU and APAC.
• Additional language skills relevant to the covered regions (e.g., Mandarin, Japanese, Korean, German).