• Bachelor’s degree or higher in EE, CE, or CS • 10+ years or more of practical semiconductor implementation experience • Scripting experience with Perl, Python, tcl, shell and drive to automate flows • Proficiency in chip front-end and back-end implementation tools such as Fusion compiler, Design Compiler, ICC2 or Innovus and Primetime, Tempus • Must have good communication and analytical skills. • Should be able to work closely with IP Design teams and Backend Physical Design teams across multiple sites. • PhD in Computer Science, Electrical Engineering, or related field • Experience with memory compiler • Experience with formal equivalence – Cadence Conformal/Synopsys Formality • Have in depth knowledge of entire design process from Design specification, defining architecture, micro-architecture, RTL design and functional verification • Experience with DFT and DFM flows Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit <a href="https://amazon.jobs/content/en/how-we-hire/accommodations">https://amazon.jobs/content/en/how-we-hire/accommodations</a> for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $143,300/year in our lowest geographic market up to $247,600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on job-related knowledge, skills, and experience. Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information, please visit <a href="https://www.aboutamazon.com/workplace/employee-benefits">https://www.aboutamazon.com/workplace/employee-benefits</a>. This position will remain posted until filled. Applicants should apply via our internal or external career site. The team that built the innovative Silicon IP AZ1 Neural Edge that is powering the latest generation of Echo devices is looking for a Senior SoC Design-STA Engineer to continue to innovate on behalf of our customers. We are a part of Amazon Lab126 that revolutionized reading with our Kindle family of products and reimagined user experience through Echo and Alexa. We want you to help us build on the success of our first generation of ML accelerator at edge. Work hard. Have fun. Make history. Key job responsibilities • Includes definition and development of signoff methodology and corresponding implementation solution • Flow for STA, Crosstalk Delay and Crosstalk Noise analysis for digital ASIC/SoCs. • Full chip timing constraints development, full chip / Sub-System STA and Signoff for a complex, multi-clock, multi-voltage SoC. • Streamlining the timing signoff criterions, timing analysis methodologies and flows. • Analyze and incorporate advance timing signoff flows (AOCV, POCV Based STA, IR Drop aware STA) into SoC timing signoff flow. • Work for Systems and Architecture, SoC Integration, Verification, DFT, Mixed Signal, IP owners, Synthesis, Place &amp; Route and other local/remote teams to address the design challenges in the context of timing sign-off. • Concepts of CRPR, clock paths analysis and tweaks to meet timing. • Multi Corner and Multimode analysis. • Close timing at Signoff corners covering the entire modes, delay corners for cells and interconnects.